Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651127 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi | 2020-05-12 |
| 10636749 | Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same | Kean Huat Leong, Chun Kit See, Sheng Jian Darren Tan, Eng Huat Goh | 2020-04-28 |