Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593618 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong | 2020-03-17 |
| 10541200 | Over-molded IC packages with embedded voltage reference plane and heater spreader | Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong, Mooi Ling Chang | 2020-01-21 |