Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797012 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Habeeb Mohiuddin Mohammed | 2020-10-06 |
| 10764989 | Thermal enhancement of exposed die-down package | Tung Ching Lui, Baltazar Canete | 2020-09-01 |
| 10636742 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Melvin Martin | 2020-04-28 |
| 10607912 | Reduction of cross talk in WLCSP's through laser drilled technique | Habeeb Mohiuddin Mohammed | 2020-03-31 |