Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636742 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Ernesto Gutierrez, III, Rajesh Subraya Aiyandra | 2020-04-28 |