Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727174 | Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Jerry Li | 2020-07-28 |
| 10636742 | Very thin embedded trace substrate-system in package (SIP) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ian Kent, Melvin Martin, Rajesh Subraya Aiyandra | 2020-04-28 |
| 10629507 | System in package (SIP) | Che-Han Li, Jesus Mennen Belonio, Jr., Shou-Cheng Hu | 2020-04-21 |