Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727174 | Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) | Jesus Mennen Belonio, Jr., Shou-Cheng Hu, Ernesto Gutierrez, III | 2020-07-28 |