Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10764989 | Thermal enhancement of exposed die-down package | Tung Ching Lui, Rajesh Subraya Aiyandra | 2020-09-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10764989 | Thermal enhancement of exposed die-down package | Tung Ching Lui, Rajesh Subraya Aiyandra | 2020-09-01 |