Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797012 | Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices | Rajesh Subraya Aiyandra | 2020-10-06 |
| 10607912 | Reduction of cross talk in WLCSP's through laser drilled technique | Rajesh Subraya Aiyandra | 2020-03-31 |