Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872861 | Semiconductor packages | Yong-Da Chiu, Shiu-Chih WANG, Shang-Kun Huang, Ying-Ta Chiu, Shin-Luh TARNG | 2020-12-22 |
| 10770369 | Semiconductor device package | Tang-Yuan Chen, Jin-Feng Yang, Meng-Kai SHIH | 2020-09-08 |
| 10658257 | Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process | Dao-Long Chen, Ming-Hung Chen | 2020-05-19 |
| 10658319 | Semiconductor devices and semiconductor packages | Dao-Long Chen, Ying-Ta Chiu, Ping-Feng Yang | 2020-05-19 |
| 10600759 | Power and ground design for through-silicon via structure | Ying-Te Ou, Pao-Nan Lee | 2020-03-24 |
| 10553527 | Substrate and semiconductor device package | Dao-Long Chen | 2020-02-04 |
| 10541198 | Semiconductor package device and method of manufacturing the same | Chien Lin CHANG CHIEN, Chin-Li KAO, Chang-Chi Lee | 2020-01-21 |
| 10535521 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chen-Chao Wang | 2020-01-14 |