Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658257 | Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process | Chih-Pin Hung, Ming-Hung Chen | 2020-05-19 |
| 10658319 | Semiconductor devices and semiconductor packages | Chih-Pin Hung, Ying-Ta Chiu, Ping-Feng Yang | 2020-05-19 |
| 10553527 | Substrate and semiconductor device package | Chih-Pin Hung | 2020-02-04 |