Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840219 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Chin-Li KAO, Meng-Kai SHIH | 2020-11-17 |
| 10770369 | Semiconductor device package | Chih-Pin Hung, Tang-Yuan Chen, Meng-Kai SHIH | 2020-09-08 |