Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840219 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2020-11-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840219 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2020-11-17 |