Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535521 | Semiconductor device packages and stacked package assemblies including high density interconnections | William T. Chen, Chih-Pin Hung, Chen-Chao Wang | 2020-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535521 | Semiconductor device packages and stacked package assemblies including high density interconnections | William T. Chen, Chih-Pin Hung, Chen-Chao Wang | 2020-01-14 |