Issued Patents 2019
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510938 | Package support, fabrication method and LED package | Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing Liang, Zhen-Duan Lin +1 more | 2019-12-17 |
| 10431713 | Nitride underlayer and fabrication method thereof | Wen-Yu Lin, Shengchang Chen, Zhibai Zhong | 2019-10-01 |
| 10418518 | Nitride underlayer and fabrication method thereof | Shengchang Chen, Wen-Yu Lin, Jie Zhang, Heqing DENG | 2019-09-17 |
| 10410893 | Micro elements transfer device and method | Jiali Zhuo, Xiaojuan Shao, Jiansen ZHENG | 2019-09-10 |
| 10367126 | Light-emitting device | Junpeng SHI, Pei-Song Cai, Hao Huang, Zhenduan Lin, Chih-Wei Chao | 2019-07-30 |
| 10297733 | High-voltage light emitting diode chip and fabrication method | Hou-Jun Wu, Jiansen ZHENG, Anhe HE, Chia-En Lee | 2019-05-21 |
| 10283677 | LED structure and fabrication method | Xinghua Liang, Hongquan He, Chia-En Lee, Te-Ling Hsia, Su-Hui Lin | 2019-05-07 |
| 10276750 | Bonding electrode structure of flip-chip led chip and fabrication method | Zhibai Zhong, Lixun Yang, Jinjian Zheng, Chia-En Lee, Junyong Kang | 2019-04-30 |
| 10263147 | Light emitting diode and fabrication method thereof | Jie Zhang, Xueliang Zhu, Chengxiao Du, Jianming Liu | 2019-04-16 |
| 10249789 | Light emitting diode chip and fabrication method | Jiansen ZHENG, Su-Hui Lin, Chih-Wei Chao | 2019-04-02 |
| 10205061 | Light emitting diode and fabrication method thereof | Huining WANG, Sheng-Hsien Hsu, Kang-Wei PENG, Su-Hui Lin | 2019-02-12 |
| 10205057 | Flip-chip light emitting diode and fabrication method | Anhe HE, Su-Hui Lin, Jiansen ZHENG, Kang-Wei PENG, Xiaoxiong LIN | 2019-02-12 |
| 10199538 | Light emitting diode and fabrication method thereof | Jie Zhang, Jianming Liu, Xueliang Zhu | 2019-02-05 |
| 10186637 | Flip-chip light emitting device and fabrication method | Zhibai Zhong, Wen-Yu Lin, YEN-CHIH CHIANG, Jianming Liu, Chia-En Lee +1 more | 2019-01-22 |
| 10186495 | Film for semiconductor device and fabrication method thereof | Junpeng SHI, Xiaojuan Shao, Kechuang Lin | 2019-01-22 |