Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10505088 | Light emitting diode packaging structure | Chih-Wei Chao | 2019-12-10 |
| 10186637 | Flip-chip light emitting device and fabrication method | Zhibai Zhong, Wen-Yu Lin, Jianming Liu, Chia-En Lee, Su-Hui Lin +1 more | 2019-01-22 |