Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431713 | Nitride underlayer and fabrication method thereof | Wen-Yu Lin, Shengchang Chen, Chen-ke HSU | 2019-10-01 |
| 10276750 | Bonding electrode structure of flip-chip led chip and fabrication method | Lixun Yang, Jinjian Zheng, Chia-En Lee, Chen-ke HSU, Junyong Kang | 2019-04-30 |
| 10186637 | Flip-chip light emitting device and fabrication method | Wen-Yu Lin, YEN-CHIH CHIANG, Jianming Liu, Chia-En Lee, Su-Hui Lin +1 more | 2019-01-22 |