Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276750 | Bonding electrode structure of flip-chip led chip and fabrication method | Zhibai Zhong, Lixun Yang, Chia-En Lee, Chen-ke HSU, Junyong Kang | 2019-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276750 | Bonding electrode structure of flip-chip led chip and fabrication method | Zhibai Zhong, Lixun Yang, Chia-En Lee, Chen-ke HSU, Junyong Kang | 2019-04-30 |