Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297733 | High-voltage light emitting diode chip and fabrication method | Hou-Jun Wu, Jiansen ZHENG, Chen-ke HSU, Anhe HE | 2019-05-21 |
| 10283677 | LED structure and fabrication method | Xinghua Liang, Hongquan He, Te-Ling Hsia, Su-Hui Lin, Chen-ke HSU | 2019-05-07 |
| 10276750 | Bonding electrode structure of flip-chip led chip and fabrication method | Zhibai Zhong, Lixun Yang, Jinjian Zheng, Chen-ke HSU, Junyong Kang | 2019-04-30 |
| 10186637 | Flip-chip light emitting device and fabrication method | Zhibai Zhong, Wen-Yu Lin, YEN-CHIH CHIANG, Jianming Liu, Su-Hui Lin +1 more | 2019-01-22 |