Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510938 | Package support, fabrication method and LED package | Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing Liang, Zhen-Duan Lin +1 more | 2019-12-17 |
| 10505088 | Light emitting diode packaging structure | YEN-CHIH CHIANG | 2019-12-10 |
| 10367126 | Light-emitting device | Junpeng SHI, Pei-Song Cai, Hao Huang, Zhenduan Lin, Chen-ke HSU | 2019-07-30 |
| 10249789 | Light emitting diode chip and fabrication method | Jiansen ZHENG, Su-Hui Lin, Chen-ke HSU | 2019-04-02 |
| 10230770 | Network proxy layer for policy-based application proxies | Feilong Xu, Lee Chen | 2019-03-12 |