Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516051 | FinFET and method of fabrication thereof | Kuo-Cheng Ching, Ching-Wei Tsai, Ying-Keung Leung, Chih-Hao Wang, Carlos H. Diaz | 2019-12-24 |
| 10510873 | Semiconductor device and manufacturing method thereof | Kuo-Cheng Ching, Shi Ning Ju, Kuan-Lun Cheng, Chih-Hao Wang | 2019-12-17 |
| 10290635 | Buried interconnect conductor | Kuo-Cheng Ching, Shi Ning Ju, Kuan-Lun Cheng, Chih-Hao Wang | 2019-05-14 |
| 10181426 | Etch profile control of polysilicon structures of semiconductor devices | Kuo-Cheng Ching, Chih-Hao Wang | 2019-01-15 |