Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513006 | High throughput CMP platform | Jiann Lih Wu, Soon-Kang Huang, James Jeng-Jyi Hwang, Chi-Ming Yang | 2019-12-24 |
| 10403532 | Semiconductor apparatus with inner wafer carrier buffer and method | Wen-Yu Huang, Li-Jen Ko, Hsiang Yin Shen | 2019-09-03 |