Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513006 | High throughput CMP platform | Jiann Lih Wu, Jason Shen, James Jeng-Jyi Hwang, Chi-Ming Yang | 2019-12-24 |
| 10357867 | Polishing system | Shih-Chi Lin, Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong +4 more | 2019-07-23 |