Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10513006 | High throughput CMP platform | Jason Shen, Soon-Kang Huang, James Jeng-Jyi Hwang, Chi-Ming Yang | 2019-12-24 |
JW
Jiann Lih Wu
Overall (2019): #415,110 of 560,194Top 75%
1
Patents 2019