Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522453 | Substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chin-Tsai Yao, Chun-Tang Lin | 2019-12-31 |
| 10510720 | Electronic package and method for fabricating the same | Chang-Fu Lin, Chin-Tsai Yao, Kuo-Hua Yu | 2019-12-17 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Yu-Min Lo, Han-Hung Chen, Chang-Fu Lin | 2019-07-23 |
| 10325872 | Fabrication method of semiconductor structure | Yi-Cheih Chen, Sung-Huan Sun, Cheng-An Chang, Chien-Hung Wu | 2019-06-18 |
| 10199331 | Fabrication method of electronic package having embedded package block | Meng-Tsung Lee | 2019-02-05 |
| 10192834 | Semiconductor package and fabrication method thereof | Chun-Chi Ke | 2019-01-29 |