Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522453 | Substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chin-Tsai Yao, Fu-Tang Huang | 2019-12-31 |
| 10403567 | Fabrication method of electronic package | Yan-Heng Chen, Mu-Hsuan Chan, Chieh-Yuan Chi | 2019-09-03 |