Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522453 | Substrate structure with filling material formed in concave portion | Chang-Fu Lin, Chun-Tang Lin, Fu-Tang Huang | 2019-12-31 |
| 10510720 | Electronic package and method for fabricating the same | Chang-Fu Lin, Kuo-Hua Yu, Fu-Tang Huang | 2019-12-17 |