Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522453 | Substrate structure with filling material formed in concave portion | Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang | 2019-12-31 |
| 10522500 | Method for manufacturing electronic package | Yu-Min Lo, Chee-Key Chung, Kuo-Hua Yu, Hsiang-Hua Huang | 2019-12-31 |
| 10510720 | Electronic package and method for fabricating the same | Chin-Tsai Yao, Kuo-Hua Yu, Fu-Tang Huang | 2019-12-17 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Yu-Min Lo, Han-Hung Chen, Fu-Tang Huang | 2019-07-23 |
| 10354891 | Electronic package and method for fabricating the same | Po-Hao Wang, Chih-Jen Yang, Yu-Chih Cheng, Chee-Key Chung | 2019-07-16 |