Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522500 | Method for manufacturing electronic package | Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang | 2019-12-31 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Han-Hung Chen, Chang-Fu Lin, Fu-Tang Huang | 2019-07-23 |