Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199331 | Fabrication method of electronic package having embedded package block | Fu-Tang Huang | 2019-02-05 |
| 10192838 | Fabrication method of packaging substrate | Chien-Lung Chuang, Po-Yi Wu, Yih-Jenn Jiang | 2019-01-29 |