Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256248 | Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof | Zhenyu Lu, Jixin Yu, Johann Alsmeier, Fumiaki Toyama, Yuki Mizutani +5 more | 2019-04-09 |
| 10249640 | Within-array through-memory-level via structures and method of making thereof | Jixin Yu, Zhenyu Lu, Alexander Chu, Kensuke Yamaguchi, Hiroyuki Ogawa +2 more | 2019-04-02 |