Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10433421 | Reduced capacitance land pad | Tao Wu, Gaurav Chawla, Jeffrey Lee | 2019-10-01 |
| 10431912 | CPU socket contact for improving bandwidth throughput | Gregorio R. Murtagian | 2019-10-01 |
| 10416378 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Kemal Aygun, Robert L. Sankman | 2019-09-17 |
| 10317932 | Capacitive structures for crosstalk reduction | Xiang Li, Kemal Aygun, Zhiguo Qian, Tolga Memioglu | 2019-06-11 |
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Kemal Aygun, Cemil Geyik, Guneet Kaur | 2019-05-28 |
| 10241361 | Color film substrate, manufacturing method thereof and display device | Tsungchieh Kuo, Zheng Liu, Mingxuan Liu, Shoukun Wang, Jingjing Jiang | 2019-03-26 |
| 10209573 | UV curing mask plate and a fabricating method thereof and a display device | Xiaoxiang Zhang, Zheng Liu, Zongjie Guo, Mingxuan Liu, Xi Chen | 2019-02-19 |
| 10209584 | Manufacturing method of metal layer, functional substrate and manufacturing method thereof, and display device | Xiaoxiang Zhang, Liping Luo, Mingxuan Liu, Huibin Guo | 2019-02-19 |