Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508961 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Feras Eid, Johanna M. Swan | 2019-12-17 |
| 10438915 | High density substrate routing in package | Chia-Pin Chiu | 2019-10-08 |
| 10199346 | High density substrate routing in package | Chia-Pin Chiu | 2019-02-05 |
| 10179729 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Sarah Haney, Feras Eid, Sasha N. Oster | 2019-01-15 |