Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Johanna M. Swan +1 more | 2019-12-17 |
| 10325843 | Integrated circuit package substrate | Qinglei Zhang | 2019-06-18 |