Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403604 | Stacked package assembly with voltage reference plane | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Shanggar Periaman | 2019-09-03 |
| 10394280 | Wearable electronic devices and components thereof | Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew +1 more | 2019-08-27 |
| 10396038 | Flexible packaging architecture | Bok Eng Cheah, Jackson Chung Peng Kong, Shanggar Periaman, Michael P. Skinner, Yen Hsiang Chew +2 more | 2019-08-27 |
| 10354957 | Electrical interconnect for a flexible electronic package | Bok Eng Cheah, Jackson Chung Peng Kong, Stephen H. Hall, Khang Choong Yong, Eric C Gantner | 2019-07-16 |