| 10503211 |
Multi-orientation display device |
Chee Chun Yee, David W. Browning, Jackson Chung Peng Kong, Min Suet Lim, Howe Yin Loo +1 more |
2019-12-10 |
| 10504854 |
Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same |
Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2019-12-10 |
| 10484231 |
Routing-over-void-T-line-compensation |
Khang Choong Yong, Jackson Chung Peng Kong, Stephen H. Hall, Yun Rou Lim |
2019-11-19 |
| 10403604 |
Stacked package assembly with voltage reference plane |
Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi, Shanggar Periaman |
2019-09-03 |
| 10396047 |
Semiconductor package with package components disposed on a package substrate within a footprint of a die |
Jenny Shio Yin Ong, Jackson Chung Peng Kong, Seok Ling Lim |
2019-08-27 |
| 10396038 |
Flexible packaging architecture |
Jackson Chung Peng Kong, Shanggar Periaman, Michael P. Skinner, Yen Hsiang Chew, Kheng Tat MAR +2 more |
2019-08-27 |
| 10354957 |
Electrical interconnect for a flexible electronic package |
Jackson Chung Peng Kong, Stephen H. Hall, Khang Choong Yong, Kooi Chi Ooi, Eric C Gantner |
2019-07-16 |
| 10334736 |
Flexible integrated circuit that includes an antenna |
Boon Ping Koh |
2019-06-25 |
| 10319698 |
Microelectronic device package having alternately stacked die |
Min Suet Lim, Jackson Chung Peng Kong |
2019-06-11 |