Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10503211 | Multi-orientation display device | Chee Chun Yee, David W. Browning, Bok Eng Cheah, Min Suet Lim, Howe Yin Loo +1 more | 2019-12-10 |
| 10504854 | Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong | 2019-12-10 |
| 10484231 | Routing-over-void-T-line-compensation | Khang Choong Yong, Bok Eng Cheah, Stephen H. Hall, Yun Rou Lim | 2019-11-19 |
| 10403604 | Stacked package assembly with voltage reference plane | Bok Eng Cheah, Ping Ping Ooi, Kooi Chi Ooi, Shanggar Periaman | 2019-09-03 |
| 10396047 | Semiconductor package with package components disposed on a package substrate within a footprint of a die | Jenny Shio Yin Ong, Bok Eng Cheah, Seok Ling Lim | 2019-08-27 |
| 10396038 | Flexible packaging architecture | Bok Eng Cheah, Shanggar Periaman, Michael P. Skinner, Yen Hsiang Chew, Kheng Tat MAR +2 more | 2019-08-27 |
| 10354957 | Electrical interconnect for a flexible electronic package | Bok Eng Cheah, Stephen H. Hall, Khang Choong Yong, Kooi Chi Ooi, Eric C Gantner | 2019-07-16 |
| 10317938 | Apparatus utilizing computer on package construction | Eng Huat Goh, Khai Ern See, Damien Weng Kong Chong, Min Suet Lim, Ping Ping Ooi +6 more | 2019-06-11 |
| 10319698 | Microelectronic device package having alternately stacked die | Bok Eng Cheah, Min Suet Lim | 2019-06-11 |