Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403604 | Stacked package assembly with voltage reference plane | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi | 2019-09-03 |
| 10396038 | Flexible packaging architecture | Bok Eng Cheah, Jackson Chung Peng Kong, Michael P. Skinner, Yen Hsiang Chew, Kheng Tat MAR +2 more | 2019-08-27 |