Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403604 | Stacked package assembly with voltage reference plane | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi, Shanggar Periaman | 2019-09-03 |
| 10388636 | Integrating system in package (SIP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Khang Choong Yong | 2019-08-20 |
| 10317938 | Apparatus utilizing computer on package construction | Eng Huat Goh, Khai Ern See, Damien Weng Kong Chong, Min Suet Lim, Chu Aun Lim +6 more | 2019-06-11 |