Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504854 | Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong | 2019-12-10 |
| 10492299 | Electronic assembly that includes a substrate bridge | Eng Huat Goh, Hoay Tien Teoh, Jia Yan Go | 2019-11-26 |
| 10396047 | Semiconductor package with package components disposed on a package substrate within a footprint of a die | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2019-08-27 |