Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475779 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Seung Wook Yoon | 2019-11-12 |
| 10446479 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Pandi C. Marimuthu, Yaojian Lin, Yu Gu, Won Kyoung Choi | 2019-10-15 |
| 10304817 | Semiconductor device and method of forming build-up interconnect structures over a temporary substrate | Yaojian Lin | 2019-05-28 |
| 10297556 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Seng Guan Chow, Yaojian Lin | 2019-05-21 |
| 10297518 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Yaojian Lin, Yu Gu | 2019-05-21 |
| 10217702 | Semiconductor device and method of forming an embedded SoP fan-out package | Yaojian Lin | 2019-02-26 |
| 10211183 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Jianmin Fang, Haijing Cao | 2019-02-19 |
| 10204866 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Jianmin Fang, Xia Feng | 2019-02-12 |
| 10204879 | Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics | Yaojian Lin | 2019-02-12 |
| 10192801 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Jianmin Fang, Haijing Cao | 2019-01-29 |
| 10192796 | Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP | Yaojian Lin | 2019-01-29 |
| 10189702 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2019-01-29 |
| 10177010 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Hin Hwa Goh, Il Kwon Shim | 2019-01-08 |
| 10170385 | Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP | Yaojian Lin, Rui Huang, Yu Gu | 2019-01-01 |