Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381291 | Lithographacally defined vias for organic package substrate scaling | Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Feras Eid | 2019-08-13 |