Issued Patents 2019
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10511268 | Segmented thermal and RF ground | Manuel Aldrete, Bonhoon Koo | 2019-12-17 |
| 10490348 | Two-dimensional structure to form an embedded three-dimensional structure | Mario Francisco Velez, Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Jonghae Kim +3 more | 2019-11-26 |
| 10468350 | Semiconductor memory device | Eunjung Kim, Hui-Jung Kim, Keunnam Kim, Bong-Soo Kim, Yoosang Hwang | 2019-11-05 |
| 10431511 | Power amplifier with RF structure | Shu Zhang, Bonhoon Koo, Manuel Aldrete, Jie Fu, Chin-Kwan Kim +2 more | 2019-10-01 |
| 10418333 | Waveguide along shielded side wall | Jie Fu, Manuel Aldrete | 2019-09-17 |
| 10373960 | Semiconductor memory devices including separate upper and lower bit line spacers | Semyeong Jang, Jemin Park, Yoosang Hwang | 2019-08-06 |
| 10361149 | Land grid array (LGA) packaging of passive-on-glass (POG) structure | Chengjie Zuo, Mario Francisco Velez, Changhan Hobie Yun, David Francis Berdy, Jonghae Kim | 2019-07-23 |
| 10354795 | Varying thickness inductor | Chengjie Zuo, Changhan Hobie Yun, Mario Francisco Velez, Robert Paul Mikulka, Xiangdong Zhang +2 more | 2019-07-16 |
| 10332671 | Solenoid inductor | Mario Francisco Velez, Niranjan Sunil Mudakatte, Changhan Hobie Yun, David Francis Berdy, Jonghae Kim +2 more | 2019-06-25 |
| 10332911 | Integrated circuits (ICs) on a glass substrate | Shiqun Gu, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2019-06-25 |
| 10325859 | Shielded stacked substrate apparatus and method of fabricating | Jie Fu, Manuel Aldrete | 2019-06-18 |
| 10325855 | Backside drill embedded die substrate | Jie Fu, Changhan Hobie Yun, Chin-Kwan Kim, Manuel Aldrete, Chengjie Zuo +2 more | 2019-06-18 |
| 10290414 | Substrate comprising an embedded inductor and a thin film magnetic core | Changhan Hobie Yun, Mario Francisco Velez, Chengjie Zuo, David Francis Berdy, Je-Hsiung Lan +3 more | 2019-05-14 |
| 10283257 | Skewed co-spiral inductor structure | David Francis Berdy, Chengjie Zuo, Changhan Hobie Yun, Jonghae Kim | 2019-05-07 |
| 10269808 | Semiconductor devices and methods of forming semiconductor devices | Bong-Soo Kim, Jemin Park, Taejin Park, Yoosang Hwang | 2019-04-23 |
| 10262786 | Stepped-width co-spiral inductor structure | Babak Nejati, Husnu Ahmet Masaracioglu | 2019-04-16 |
| 10249580 | Stacked substrate inductor | Changhan Hobie Yun, David Francis Berdy, Chengjie Zuo, Mario Francisco Velez, Jonghae Kim | 2019-04-02 |
| 10242957 | Compartment shielding in flip-chip (FC) module | Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo, Jonghae Kim +1 more | 2019-03-26 |
| 10187031 | Tunable matching network | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +4 more | 2019-01-22 |
| 10171112 | RF multiplexer with integrated directional couplers | Yunfei Ma, Chengjie Zuo, David Francis Berdy, Changhan Hobie Yun, Je-Hsiung Lan +4 more | 2019-01-01 |