Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne | 2019-08-20 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim | 2019-01-08 |