Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446455 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2019-10-15 |
| 10297515 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2019-05-21 |
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |