Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468343 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2019-11-05 |
| 10366943 | Packaged electronic device having stepped conductive structure and related methods | Jia Yunn Ting, Hyeong Il Jeon | 2019-07-30 |
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |