Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366943 | Packaged electronic device having stepped conductive structure and related methods | Byong Jin Kim, Jia Yunn Ting | 2019-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366943 | Packaged electronic device having stepped conductive structure and related methods | Byong Jin Kim, Jia Yunn Ting | 2019-07-30 |