Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Choon Heung Lee | 2019-01-08 |