Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2019-08-20 |
| 10304890 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2019-05-28 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |