Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515825 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2019-12-24 |
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2019-08-20 |
| 10297466 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2019-05-21 |
| 10224217 | Wafer level fan out package and method of fabricating wafer level fan out package | Jin Young Kim, Seung Jae Lee | 2019-03-05 |
| 10199322 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2019-02-05 |