Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304890 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2019-05-28 |
| 10290621 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2019-05-14 |
| 10199322 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2019-02-05 |